Intel AgilexTM Direct Radio Frequency Multi Chip Package with Embedded Multi-Die Interconnect Bridge – The First State-of-The-Art Heterogeneous Integrated Multi-Chip Package
Erasenthiran Poonjolai1, Pradeep Jayavelmurugan2, Emre Armagan3, Sandeep Mallampati4, Bjorn Birkner5, Carmine Pagano2, Bhavanasri Devaraj3, Vidya Jayaram1, Benjamin Esposito2, John Sotir2, Saikumar Jayaraman1, Darren Crum6
1Technology Integration, Assembly Test Technology Development, Intel Corp
2SHIP Business / Embedded Acceleration Division, PSG Intel Corp
3Quality and Reliability , Assembly Test Technology Development, Intel Corp
4Product Reliability Qualification Group
5Sort Test Technology Development, Intel Corp
6Naval Surface Warfare Center (NSWC), Crane Division
Abstract - Heterogeneous integration using Multi chip packaging has become a key technology enabler for meeting the high bandwidth demands of next generation compute architectures. Recent advances in packaging technologies, such as Intel’s Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology have enabled building complex compute architectures in a single package using multi-technology chiplet integration. These advances have provided designers with the flexibility to build systems in a single package using optimized and custom chiplets with unique functionalities and process technology of choice coupled with standardized low power, high bandwidth IO links. Intel's Advanced Interface Bus (AIB) is a die-to-die PHY level standard that enables a modular approach to system design with a library of chiplet intellectual property (IP) blocks. Combining Intel’s FPGAs with AIB interfaces and EMIB packaging technology provides a unique opportunity to develop a new class of products for defense applications that meets the system requirements in a small form factor with greater flexibility, scalability, ease of use, and faster time to market.