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2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Toronto, Ontario Canada
Oct 6, 2024 - Oct 9, 2024
Abstract Submission Date: Jun 14, 2024
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2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Taipei, Taiwan
Oct 22, 2024 - Oct 25, 2024
Abstract Submission Date: Jun 23, 2024
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2024 IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan
Nov 13, 2024 - Nov 15, 2024
Abstract Submission Date: May 31, 2024
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2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
Singapore
Dec 3, 2024 - Dec 6, 2024
Abstract Submission Date: May 31, 2024
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IEEE Electronics Packaging Award
Recipient of the 2024
IEEE Rao R. Tummala Electronics Packaging Award
Madhavan Swaminathan
“For contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems.”
Lisbon, Portugal
May 12, 2024 - May 15, 2024
Albany, New York USA
May 13, 2024 - May 16, 2024
Prague, Czech Republic
May 15, 2024 - May 19, 2024
Join your professional colleagues –become a member of EPS.