TC - Test

Chair: Abram Detofsky,Intel

Website: Test TC webpage

Focus:  The semiconductor industry is aggressively embracing heterogeneous integration and advanced packaging. This trend has a significant impact on test strategy, test flow, and test equipment tooling. Packaging and test ecosystems can no longer operate independently and need to be more integrated in order to deliver co-optimized solutions

Today, packaging/assembly and test operate (mostly) independently of each other. Goal is to bridge the gap between these two communities and drive co-optimization.

Committee Meetings:  At ECTC and other major international conferences.