Kuan Yew Cheong Bio

Topic: Engineering Materials for Advanced Packaging and Physical Failure Analysis and Strategy

Email:srcheong@usm.my 

 

KUAN YEW CHEONG (S’01–M’05-SM’15) is a Professor of School of Materials & Mineral Resources Engineering at the Universiti Sains Malaysia, Malaysia. He received his PhD from Griffith University, Australia in 2004. Currently, he is working on designing, processing, characterizing of engineering materials for wafer (Si- and wide bandgap-based semiconductors) and package level, including physical failure analysis of these applications. He has published more than 250 high impact-factor journals, 6 reputable book chapters, 5 edited books, 1 granted Malaysian Patent, and delivered close to 300 technical training courses, for the past 14 years, related to failure analysis techniques/strategies and engineering materials for wafer and advanced packaging. Prof. Cheong is also actively involved in IEEE EPS activities, serving as a Vice President of IEEE EPS Malaysia Section and Executive Committee for more than 10 years, organizing committees of IEEE EPS/IEEE flagship conferences, such as IEMT, and delivered tutorials and keynotes in conferences organized by IEEE.  Currently, he is Editor-in-Chief of “Materials Science in Semiconductor Processing” (Elsevier), Fellow of The Institution of Engineers Malaysia (IEM), Senior Member of IEEE, Principal Interviewer for Professional Interview of IEM, Senior Evaluation Panel of Engineering Program Accreditation under Engineering Accreditation Council, Malaysia, Founding Chairman of Material Engineering Technical Division under IEM, and technical consultant of failure analysis for MIMOS Semiconductor Sdn Bhd (Malaysia).