John H. Lau Bio

Topics: Electronics and Photonics 2D and 3D packaging and manufacturing

John Lau Picture3

John H. Lau (Life Fellow, IEEE) received the Ph.D. degree from the University of Illinois at Urbana–Champaign in 1977 and three master degrees from the University of British Columbia in 1973, the University of Wisconsin–Madison in 1974, and Fairleigh Dickinson University in 1979. He also earned a bachelor’s degree from the National Taiwan University in 1970. He was a Senior Scientist/MTS with the Hewlett-Packard Laboratory and Agilent, Palo Alto, CA, USA, for 20 years, the Director of the System Packaging Laboratory, Institute of Microelectronics, Singapore, for two years, a Visiting Professor with The Hong Kong University of Science and Technology, Hong Kong, for one year, a Specialist with the Industrial Technology Research Institute, Taiwan, for five years, and a Senior Technical Advisor with ASM Pacific Technology, Hong Kong, for five years. He was the CTO from July 2019 to June 2021 and has been a Senior Special Project Assistant with Unimicron Technology Corporation, Taiwan, since July 2021. He has more than 40 years of research and development and manufacturing experiences in semiconductor packaging and surface-mount technology assembly, published more than 528 peer-reviewed papers (380 are the principal investigator), 53 issued and pending U.S. patents (34 are the principal inventor), and 23 textbooks such as Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023) and Flip Chip, Hybrid Bonding, Fan-in and Fan-out Technology (Springer, 2024). John is an elected ASME Fellow and IMAPS Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share. He received many awards, including the ASME Worcester Reed Warner Medal and the IEEE Components Packaging and Manufacturing Technology Field Award.

The technical topics I can cover are:

• Chipet Design and Heterogeneous Integration Packaging

• Co-Packaged Optics – Heterogeneous Integration of Photonic IC and Electronic IC

• Advanced Packaging: 2D, 2.1D, 2.3D, 2.5D, and 3D IC Integration

• Organic Interposers vs. TSV Interposers

• Packaging Technologies Driven by Artificial Intelligence

• Flip Chip and Hybrid Bonding Technology