Dongkai Shangguan Bio

Email: dshangguan@yahoo.com

Topics: Heterogeneous Integration and SiP; Electronics Packaging and Miniaturization; Materials; Thermal management; Reliability; Electronics manufacturing technology; Flexible hybrid electronics

Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates Inc. (TEA), and a Strategic Advisor to innovative companies in the global semiconductor and electronics industry. Previously, he served as Corporate Vice President at Flex (formerly Flextronics) and as Chief Marketing Officer at STATSChipPAC (currently JCET). Early in his career, he held various technical and management responsibilities at Ford Electronics and Visteon.

Dr. Shangguan has published 3 books, authored/co-authored over 200 technical papers, and has been issued 32 U.S. patents.

Dr. Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the William D. Ashman Achievement Award from IMAPS, the President’s Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers.

Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. in Materials from the University of Oxford, U.K. He conducted post-doctoral research at the University of Cambridge and The University of Alabama.