Rohit Sharma Bio
Email: rohit@iitrpr.ac.in
Rohit Sharma1, 2, Senior Member, IEEE
1 Department of Electrical Engineering, Indian Institute of Technology Ropar, Rupnagar, 140001, Punjab, India
2 School of Electrical Engineering and Computer Science, The Pennsylvania State University, University Park, PA, 16802, USA
Topics:Design of High-speed Graphene-based and 2D materials-based nanoelectronics; Electrical-Thermal co-design of electronic packages and microsystems; Application of Machine Learning in design and analysis of interconnects; Heterogeneous integration.
Rohit Sharma (M’07 – SM’15) received the B.E. degree in electronics and telecommunication engineering from North Maharashtra University, India, in 2000, the M. Tech. degree in systems engineering from Dayalbagh Educational Institutes, India, in 2003 and the Ph.D. degree in electronics and communication engineering from Jaypee University of Information Technology, India, in 2009. He worked as a Post-Doctoral Fellow at the Design Automation Lab at Seoul National University, Seoul, Korea from Jan 2010 to Dec 2010. He was a Post-Doctoral Fellow at the Interconnect Focus Centre at Georgia Institute of Technology, Atlanta, USA from Jan 2011 to Jun 2012.
Dr. Sharma is an Associate Professor (presently on leave) in the Department of Electrical Engineering at the Indian Institute of Technology Ropar and is currently a Research Professor at the School of EECS, Pennsylvania State University. His research interests include design of high-speed chip-chip and on-chip interconnects, Graphene based nano-interconnects, and signal and thermal integrity in high-speed interconnects. He is an Associate Editor of the IEEE Transactions on Components, Packaging and Manufacturing Technology and a program committee member in all major IEEE packaging conferences ECTC, EPEPS, SPI and EDAPS). In the past, he has been the chair of the IEEE EPS Technical Committee on Electrical Design, Modeling, and Simulation and is a Senior Member of the IEEE.