E. Jan Vardaman Bio

Email: jan@techsearchinc.com

Topics: International developments in semiconductor packaging, manufacturing and assembly; SiP: Business and technology Trends; Drivers in advanced packaging; Flip chip and wafer level packaging 

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987.  She was the editor of Recent Developments in Tape Automated Bonding published by IEEE Press.  She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly.  She served on the NSF-sponsored World Technology Evaluation Center (WTEC) study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China.  She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer.  She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, the Sidney J. Stein International Award in 2019, and she is an IMAPS Fellow.  She is a member of MEPTEC, SMTA, and SEMI.  She serves on the JEDEC Task Force JESD-94 Working Group Application Specific Qualification Using Knowledge Based Test Methodology.  She has served on the IEEE CPMT Board of Governors for two terms.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.  She received her M.A. from University of Texas, in 1981.