Gamal Refai-Ahmed Bio
Email : gamal.refai-ahmed@amd.com
Topics: Thermo-mechanical Semiconductor and Electronics Industry Roadmap and directions, Advanced holistic Thermo-mechanical solution, assembly and reliability of Heterogeneous Packaging and Silicon Photonics, Future thermo-mechanical technology, architecture for component and system
Dr. Gamal Refai-Ahmed, Life Fellow ASME, Fellow IEEE, Member of National Academy of Engineering, Fellow Canadian Academy of Engineering, Fellow Engineering Institute of Canada, is AMD Sr Fellow. He obtained the Ph. D. degree from the University of Waterloo.
He has been recognized as one of the global technical leaders through his numerous publications (more than 120 publications) and patents& patents pending US and International (more than 110). His contributions are clearly seen in several generations of both GPU, CPU and FPGA for HPC, AI, ML, NIC, Game Console, Aerospace& Defense and Telecom products.
In 2015-2021, Gamal was a Fellow Engineer in Xilinx. This is to initiate the heterogeneous integration of system level power, thermal, mech and assembly with package and Si development in first initial planning. He has been a key player to introduce all Xilinx Alveo products and high-end Si CoWos, InFo, Chiplets PKG to Xilinx Customers. He was behind the introduction of the first Lidless FPGA 20, 16, 7nm technology nodes with highest warpage in mass production in Xilinx Alveo products, and its Telecom, AI, HPC customers (e.g. MSFT, AWS, Nokia, Cisco and A&D). his developed strategy of technology enable Xilinx FPGA products to outperform the Intel/Altera Products. As a result, he was promoted in Mid of 2020 to Xilinx Fellow.
Gamal is the recipient of 2008 excellent thermal management award, 2010 Calvin Lecture and 2013 K16- Clock award in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice. In 2014, Gamal received the IEEE Canada R. H. Tanner Industry Leadership for sustained leadership in product development and industrial innovation. In 2016, ASME awarded Gamal the ASME Service Award. State University of New York, Binghamton University awarded him the Innovation Partner Award for his industrial role with Binghamton University. In continuation to Dr Refai contributions to the best engineering practice, State University of New York at Binghamton awarded him the Presidential University medal in 2019 which is the highest recognition honor by the university. In 2021, Gamal was elected to IEEE Fellow and EIC Fellow. Gamal was elected as a member in the National Academy of Engineering in 2024.
Dr. Gamal Refai-Ahmed, a Life Fellow of the American Society of Mechanical Engineers (ASME), Fellow of the Institute of Electrical and Electronics Engineers (IEEE), Fellow of the Canadian Academy of Engineering, Fellow of the Engineering Institute of Canada and a Member of the National Academy of Engineering (NAE), has led a prolific career spanning over three decades in both industry and academia. Renowned for his pioneering efforts in thermal management, system integration, and advanced packaging, his work has been instrumental in driving innovation and leadership in the engineering domain.
Technical Pioneering: Authored more than 125 publications and holds over 115 US and international patents, influencing advancements across a broad spectrum of fields such as High-Performance Computing (HPC), Artificial Intelligence (AI), Machine Learning (ML), Network Interface Cards (NICs), gaming consoles, aerospace and defense, and telecommunications.
At AMD, he was pivotal in integrating system-level considerations—power, thermal, mechanical, and assembly—within package and silicon development, leading to the launch of high-end silicon GPU and FPGA packages.
Leadership and Recognition: Dr. Refai-Ahmed's contributions have been acknowledged through prestigious awards, including the ASME Service Award (2016), IEEE Canada R. H. Tanner Industry Leadership Award (2014), and the SUNY Binghamton University Presidential Medal (2019).
His election as a Fellow of ASME, IEEE, EIC, and CAE, and his induction into the NAE, underscore his exceptional impact on the engineering community.
Dr. Refai-Ahmed's unwavering dedication to advancing engineering boundaries and promoting excellence has solidified his position as a pivotal asset to the NAE. His remarkable career not only inspires future generations of engineers but also stands as a testament to the transformative power of innovation and leadership in engineering.
Dr. Gamal Refai-Ahmed’s technical interest in thermal management, system integration, and advanced packaging, brings over three decades of impactful innovation across HPC, AI, ML, NICs, and more. His pioneering work at AMD integrating system-level considerations, yielded high-end Si packages and groundbreaking lipless FPGAs, boosting AMDx's market position. Driven by a passion for pushing boundaries and fostering excellence, he has authored over 120 publications and secured 110+ patents, showcasing his dedication to impactful engineering. This makes him a valuable asset to the NAE and an inspiration to future generations.