Kemal Aygün Bio

Email: kemal.aygun@intel.com

Topics: Architectures and electrical analysis/validation of advanced packaging and heterogenous integration technologies, electrical standards for advanced packaging, high-speed signaling, signal integrity

Kemal Aygün received the Ph.D. degree in electrical and computer engineering from the University of Illinois at Urbana-Champaign, Urbana, IL, USA, in 2002. In 2003, he joined the Intel Corporation, Chandler, AZ, USA, where he is currently an Intel Fellow and manages the High Speed I/O (HSIO) team in the Electrical Core Competency group. He has co-authored five book chapters, more than 90 journal and conference publications, and holds 96 U.S. patents. His research interests include novel technologies along with electrical modeling and characterization techniques for microelectronic packaging. Dr. Aygün was a recipient of the Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) Mahboob Khan Outstanding Mentor Award in 2008 and 2015 for his contributions in mentoring SRC GRC academic research projects. He was the General Chair of the 2020 IEEE Electrical Performance of Electronic Packaging and Systems Conference. He is an IEEE Fellow and has been acting as a Distinguished Lecturer for the IEEE Electronics Packaging Society (EPS); a co-chair of the EPS Technical Committee on Electrical Design, Modeling, and Simulation; and an associate editor for the IEEE Transactions on Components Packaging, and Manufacturing Technology.