Rajen Murugan Bio

Email: r-murugan@ti.com

Topics: Multiphysics and System Co-Design modeling for complex analog and mixed-signal packaging, mmWave/THz packaging signal integrity, advanced power electronics packaging/module, and system-Level EMI/EMC modeling, analysis, and characterization.

Dr. Rajen Murugan specializes in developing multiphysics system co-design simulation and modeling methodologies for advanced IC packaging and systems. He is currently a Distinguished Member of the Technical Staff (DMTS) with Texas Instruments, Inc. He has 31 granted (US and Canada) patents and 73 under review at the USPTO. He has published over 60 papers in peer-reviewed IEEE journals and conferences. Dr. Murugan holds a Ph.D. in Applied Electromagnetics from the University of Manitoba, Canada. He is an Affiliate Assistant Professor with the University of Washington Electrical Engineering Department, a Distinguished Lecturer for the IEEE Electronics Packaging Society (EPS), an Associate Editor for the IEEE Transactions on CPMT journal, a Senior Member of IEEE, the founder of the IEEE EPS Dallas Chapter, and the current Chair of the IEEE Dallas Section (Region 5).