IEEE Electronics Packaging Society IEEE Electronics Packaging Society

Tanja Braun Bio

Email: Tanja.Braun@izm.fraunhofer.de

Topics:  Advanced Packaging, Heterogeneous Integration, Flip Chip, Chiplet, Fan-out Wafer and Panel Level Packaging.  

Braun

 

 

 

 

 

 

Dr. Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin. Tanja Braun is head of the department System Integration and Interconnection Technologies. Recent research is focused on Fan-out Wafer and Panel Level Packaging technologies. In 2021 she received the Exceptional Technical Achievement Award from IEEE Electronics Packaging Society (EPS) and the IMAPS Sidney J. Stein Award for her work in the field of Fan-out Wafer and Panel Level Packaging.

Tanja Braun is an active member of IEEE. She is member of the IEEE EPS Board of Governor (BOG) and the IEEE EPS VP of Conferences.