William Chen Bio

Topics: Semiconductor and Electronics Industry Trends and Roadmap

Bill Chen Photo

William (Bill) Chen holds the position of ASE Fellow & Senior Technical Advisor at ASE Group. Prior to joining the ASE, he was Director at the Institute of Materials Research & Engineering (IMRE) in Singapore, following a distinguished career at IBM Corporation. Bill is a past President of the IEEE Electronics Packaging Society. He is a Life Fellow of IEEE and a Fellow of ASME. He received the ASME InterPACK Achievement Award in 2007. In 2017 he received the ASME Ecellence in Mechanics Award. In 2018, he received the IEEE Electronics Packaging Field Award, recognizing his contribution to electronic packaging, from research & development through industrialization. He received the IMAPS Daniel C. Hughes Memorial Jr. Award in 2022 for lifetime achievement to the microelectronics industry..

Bill chairs the Heterogeneous Integration Roadmap initiative, co-sponsored by 3 IEEE Societies (EPS, EDS & Photonics) together with SEMI & ASME Electronics & Photonics Packaging Division.