Xuejun Fan Bio

Topics: Design, modeling and reliability in micro-/nano- electronic packaging and microsystems

Xuejun Fan is a Regents’ Professor of Texas State University System, and a Mary Ann and Lawrence E. Faust Endowed Professor at Lamar University, Beaumont, Texas. Dr. Fan received a B.S. degree in Applied Mechanics and an M.S. degree in Solid Mechanics from Tianjin University in 1984 and 1986, respectively. In 1989 he earned a Ph.D. degree in Solid Mechanics from Tsinghua University.

Dr. Fan is an IEEE Fellow, and an IEEE Distinguished Lecturer. He received the Outstanding Sustained Technical Contribution Award in 2017, and the Exceptional Technical Achievement Award in 2011 from Electronic Packaging Society of IEEE. He is a co-chair of Modeling and Simulation in Heterogeneous Integration Roadmap committee.

Dr. Fan gained 10-year significant experience in semiconductor industry with the Institute of Microelectronics (IME) in Singapore (1997-2000), Philips Research in Briarcliff Manor (2000-2003), and Intel in Chandler, Arizona (2004 – 2007), prior to Lamar University.

Dr. Fan’s current area of interest is multi-scale, multi-physics modeling, characterization, and reliability study for heterogeneous integration. He has published 4 books, 25 book chapters, and over 300 technical papers.

In his early academia career in China, Dr. Fan was the recipient of a Young Faculty Award from the Fok Ying-Tung Education Foundation in 1994. He received the nominee for the title of “Ten Outstanding Youth of China” in 1991.