University of Waterloo and Joint EPS/EMC Montreal Chapter Webinar
Title: Trends and Challenges for Electrical Design and Analysis Using Advanced Packaging
Presenter: Dr. Kemal Aygun
Date: March 17, 2021 11:00 AM EDT
Abstract: As the electronics industry is going through some rapid changes, the new electronics systems need to provide increasingly higher performance. As a result, the capability of the components that constitute these systems needs to also scale accordingly. One area where the pace of innovation has greatly increased in recent years is semiconductor packaging. Paving the way for heterogeneous integration, these new ‘advanced’ packaging technologies aim to integrate multiple logic, memory, and other specialized silicon dies, potentially using different silicon process technologies, and provide unprecedented levels of performance in metrics such as IO bandwidth, bandwidth density, and power efficiency. This presentation will review some of these new advanced packaging technologies such as fan-out wafer/panel level and 2.xD packaging and the key challenges and some solutions for their electrical design and analysis.
University of Waterloo Webinar
Title:Holistic Understanding of Thermo-Mechanical challenges from Package to System to Maximize Silicon Performance
Presenter: Gamal Refai-Ahmed
Date and Time: March 4th at 3:00 PM EST
Abstract: This presentation is addressing the impact of the assembly and manufacturing technology and direction on the advancing packaging Mechanical integrity and its thermal characterizations. In this talk, the audiences will be able to see clearly the full picture to answer the question of will Lidded or Lidless Advanced Packaging have better Thermo-Mechanical Characteristics?. The answer to this question needs to have a full understanding of the manufacture and assembly, materials behavior, the cost, the mechanical stresses, the end user application and the target thermal performance. It is not a surprise to find a wrong direction can impact the package performance and lose more than 30% to 50% of its performance.
IEEE’s Nanotechnology Conferences with focus in Nanopackaging - Abstracts Due Now
IEEE-NANO is the flagship IEEE International Conference on Nanotechnology, which has been a successful annual conference since 2001. Recent conferences were in Macau (2019), Cork (2018), Pittsburgh (2017), Sendai (2016), Rome (2015), and Toronto (2014). Due to the COVID-19 pandemic, the IEEE-NANO 2020 was held virtually.
The conference scope spans both nanoscience and nanotechnology, including:
- Nanoscale interconnections
- Flexible and hybrid electronics
- Power management, energy storage and harvesting
- Nanomaterials for RF to THz, metasurfaces, plasmonics
- High-power and High-Reliability packaging
- Bioelectronic packaging
- Package modeling at nanoscale
Conference Dates: July 28th to 30th of 2021.
Abstract Submission: February 28th 2021
Submission of 4-page Manuscript to proceedings: May 1st 2021
Abstracts can be submitted at: https://2021.ieeenano.org/authors/abstract-submission-for-review/
EPS Membership Survey: Thank You and Next Steps
In December 2020, EPS launched a survey sent to EPS members with the objective to get feedback on overall satisfaction with EPS benefits, what resources are important to them, and how they prefer to receive information from the Society. Nearly 300 of our members responded to this survey, and I’d like to say thank you very much to those of you who provided your thoughts and opinions…your time is very much appreciated! When this survey was sent to our members, we indicated that we would provide a summary of some of the feedback we received. The following are a few of the insights we received from the survey that we think will be interesting for our members.
Overall member satisfaction with EPS seems to be very good…77% of respondents indicated they are satisfied or highly satisfied and nearly 90% indicated their intention to renew their EPS membership. Obviously, these data points indicate there is some opportunity for us to improve (19% were neutral on their EPS satisfaction and nearly 5% were not likely to renew their membership), and so we will continue to work on ways that your EPS membership can provide increased professional, technical, and personal value to you.
Silicon Photonics - Trends, Highlights and Challenges Overview
The Cisco Global Cloud Index estimates that total data center traffic (all traffic within or exiting a data center) will reach almost 20 zettabytes per year by 2021, up from 7 zettabytes in 2016. Data center traffic on a global scale will grow at a 25 percent CAGR, with cloud data center traffic growth rate at 27 percent CAGR or 3.3-fold growth from 2016 to 2021.
The growth in internet traffic not only accelerates the need for next-generation technology to support higher port density and faster speed transitions but is also accompanied by large physical data center sizes as well as faster connectivity between the data centers. As the data rates and distances to carry high speed data are increasing, the limitations of traditional copper cable and multimode fiber-based solutions are becoming apparent and the industry focus is shifting towards adoption of single-mode fiber-optic solutions.