IMPACT 2021 Call For Papers
IMPACT 2021 Conference, organized by IEEE-EPS-Taipei, iMAPS- Taiwan, ITRI and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year will be held on Oct. 20th - 22nd at Taipei Nangang Exhibition Center, in conjunction with TPCA Show 2021. For grasping the latest trend, the symposium this year highlights the theme “IMPACT on 5G+”. As the rapid growth of 5G coverage over the world, the 5G commercial network enables an array of revolutionary technologies such as loT, artificial intelligence (AI), edge computing and wearable devices. Given the foundational infrastructure is advancing along with technologies, 5G brings faster speed and connectivity to those using it.
IEEE EPS Silicon Valley Chapter Webinars
The Silicon Valley EPS chapter invites engineers around the world to their free virtual technical seminars scheduled for 2021. For an updated full listing, visit http://www.ieee.org/scveps. Links to past events held so far this year (e.g., HIR Symposium, Technical Working Group meetings, and follow-up discussion sessions) can also be found on the Chapter’s website.
Luu Nguyen, Director of Programs,EPS Silicon Valley Area Chapter
April 22, 2021 – Noon Pacific: “Packaging and interconnect technologies for cryogenic and quantum systems,” M. Hamilton, Auburn University.
May 6, 2021 – Noon Pacific: “Results of low-temperature polyimide processing for interconnect RDL in next generation 3D advanced IC backend applications,” Z. Karim, Yield Engineering Systems.
ECTC 2021 Registration Now Open
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Recent Advances in Implantable Medical Systems with Highly-Heterogeneous Integration
Abstract: Future implantable biomedical systems will require power and data telemetry with multiferroic interfaces, signal modulation, low-impedance electrodes with high current injection, remateable connectors - all in a highly miniaturized form-factor with reliability in a reactive aqueous environment. They provide a combination of functions such as neural recording and stimulation, imaging, spectroscopy, electrochemical sensing and others. They, thus, drive the most advanced heterogeneous integration. Advancing system components and their 3D connectivity in small form-factors are both critical to realize such future medical implants. The system components are advanced through innovative nanomaterials, multiphysics-based material designs to achieve the performance metrics, and hybrid additive and semi-additive manufacturing technologies. The integration technologies rely on advanced chiplet fan-out embedding technologies in flexible or rigid-flex substrates that provide seamless but reliable interconnect technologies between the system components. This article will briefly review some of the key functional packaging build blocks towards these heterogeneous 3D implanted medical systems.
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