Call for Abstracts: Symposium on Reliability for Electronics and Photonics Packaging
-- November 11-12, 2021 (virtual, and in-person in Silicon Valley)
-- Download the Call for Presentations; submit a proposal by 1 September
-- Join the REPP Distribution List for updates
State-of-the-Art Packaging, Interconnects and AiP Modules for Millimeter-Wave 5G+ Applications
Introduction
The introduction of mmWave 5G introduces new challenges to interconnects and packaging. The higher frequencies means that interconnects between chips and board need to be low loss and high bandwidth. The additive manufacturing method enables a high level of integration between antenna and electronics and serves as the primary design tool to create low-cost and highly customizable wireless system designs which can enable rapid deployment of large-scale 5G communication and IoT systems. The versatility of additive manufacturing for packaging allows for customizable packaging structures and modules and allows designers to enable high performance with minimal tooling required. Additionally additive manufactured interconnects can enable novel structures which operate much better at higher frequencies than traditional methods. The nature of additive manufacturing allows electronics to be manufactured with very little waste and allows quick iteration allowing a drastic reduction in time-to-market. This article will discuss several packaging structures for mm-Wave capable modules utilizing additive manufacturing for use in communication, energy harvesting and reconfigurable surfaces.
Top T-CPMT Papers on Xplore
You can find the most accessed T-CPMT articles on Xplore here
Call for Papers - 10th IEEE CPMT Symposium Japan (ICSJ2021)
November 10-12, 2021
A Hybrid Event of On-site and Virtual Meetings
On-site Venue: Kyoto Univ. Clock Tower Centennial Hall, Kyoto, JAPAN
"Electronics Packaging for 5G and B5G"
"IEEE CPMT Symposium Japan (ICSJ)" is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. This conference was inaugurated in 1992 as "The VLSI Packaging Workshop in Japan (VPWJ)" to provide a platform for you to communicate and interact with global leaders in packaging technology. Later in 2010, this conference was renamed to "ICSJ" and ICSJ2021 is the 10th ICSJ meeting, or 19th conference since establishing VPWJ. This year, ICSJ2021 will be a hybrid event of on-site and virtual meetings where several presentation options are available for the authors to select and the details will be announced on the official website at a later date.
Upcoming Emerging Technologies TC Webinar
Title: Ultrafast Time Domain Cryogenic CMOS Device Characterization Platform for Quantum Computing Applications
Date: September 30, 2021
Time: 12:00 pm PDT/3:00 pm EDT
Presenter: Pragya Shrestha, NIST
You can earn 1 Professional Development Hour (PDH) for attending this webinar by completing the PDH survey form
Abstract: Cryogenic electronics have a wide range of applications, ranging from quantum information science to extra-terrestrial electronics to gravitational wave research to high performance computing. However, the dominant application leading the way for cryogenic electronics research, is quantum computing where electronic functionality at the 4 K or below has become a requirement. The most promising candidate to fulfil this functionality without disturbing the cryogenic environment with a path to large-scale integration is CMOS. Therefore, a lot of effort has been put in to hunt for the right CMOS device technology and obtain their low temperature models for designing reliable and accurate cryogenic circuits. Though it has been acknowledged that precise characterization is crucial for reliable low power and low temperature circuit design, obtaining reliable device characterization and reliability at low temperatures has not been sufficiently addressed. Absent specially is the time domain characterization of devices which are crucial for designing accurate analog circuitry. This webinar will review the challenges of using cryogenic CMOS in the field of quantum computing and further discuss the motivation for creating cryogenic ultra-fast time domain device characterization setup for accurate high-performance cryogenic CMOS circuit design.