Webinar: To Chiplet or Not To Chiplet: Heterogeneous Integration and Chiplets
-- HI, large die sizes, cost of miniaturization, splitting the die, when chiplets make sense ...
Speaker: Mudasir Ahmad, Advanced Technology Development, Google
Date: Thursday, March 24, 2022
Time: 12:00 Noon (PST)
Cost: none
Location: on the Internet (via WebEx)
Info and Reservations: https://r6.ieee.org/scv-eps/?p=2860
Summary: In this talk, we present an open economic model that anyone can utilize to determine if/when chiplets make sense and when they do not. While most large corporations have sophisticated wafer yield and cost models, having an open-source model that captures KGD, chiplet assembly steps, advanced packaging and overall yield can help speed up the decision-making process on chiplet integration. Such an open-source economic model can also help accelerate innovative technology investments and even open up newer business models to explore the costs of developing chiplets while delivering step function value. By attending this talk, you will achieve an understanding of what key factors need to be accounted for in deciding on chiplets and how the uncertainty of those factors can influence your design and business model options. You will be empowered with an open-source model that you can use to make your own decisions and tradeoffs so you can be better prepared for the consequences of those tradeoffs and achieve your business objectives faster.
2022 IEMT Call For Papers
IEEE IEMT 2022 invites you to submit your work to the 39th IEMT 2022 that will be held in Le Meridian, Putrajaya, Malaysia. It is an international event organized by the IEEE-EPS, Malaysia Chapter, with co-sponsorship from IEEE Electronic Packaging Society (EPS). The IEMT typically attracts more than 400 attendees over the world. The last IEMT 2018 (Melaka, Malaysia) hosted 600 attendees, with 100 accepted papers and interactive presentation featured in 16 sessions. IEMT 2022 welcomes papers covering electronics packaging technology in diverse semiconductor market. This segment includes telecommunication, data center, automotive, EV, healthcare, aerospace, defense and others.
Greetings from the EPS President
Hi There!
Happy New Year to our Electronic Packaging Society (EPS) community!!
I want to take a few moments of your time to tell you how excited I am to be taking over the Presidency of the EPS. First, and foremost, I am grateful for the confidence placed in me to do this job and I intend to do it well (with your help of course). I have some big shoes to step into with Chris Bailey leaving, so I know it won't be easy. Fortunately, myself and the EPS community are supported by a solid team of volunteers and staff that make up the EPS BoG (Board of Governors). Through this team I want to ensure that we, the EPS Community, will continue to maintain and grow our relevance in the electronics packaging industry.
2022 ESTC Call For Papers, Sponsors & Exhibitors
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. The 9th ESTC will be taking place in Sibiu, Romania September 13 -16, 2022 . Placed in the middle of Romania, surrounded by the high Carpathian Mountains and Cibin river, Sibiu is a citadel of the European electronics industry and represents a place where culture, landscape, gastronomy and profession merge in a friendly pleasant environment.
The ESTC 2022 seeks original, noncommercial papers describing research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.
The ESTC 2022 offers attractive packages for sponsors and exhibitors!
It’s Time To Renew Your IEEE Electronics Packaging Society (EPS) Membership!
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