1st CALL FOR PAPERS

The 24th IEEE Electronics Packaging Technology Conference (EPTC2022) will be held December 7th -9th, 2022 in Singapore. Authors are invited to submit  abstracts between 500–750 words long and clearly state the purpose, methodology, results (which must include data, drawings, graphs and photographs) and conclusions of the work.  Additional details on abstracts submission can be found on the EPTC website. Abstracts must be received by June 30, 2022.

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IEEE EPS Malaysia AGM - 12th February, 2022

This year IEEE EPS Malaysia Chapter held their AGM 100% Online.  Please join me in congratulating the incoming IEEE Electronic Packaging Society (EPS) Malaysia Chapter committee that is led by Dr Yik Yee TAN.

IEEE Malaysia Chapter Won the IEEE Malaysia Section - 2021 Outstanding Small Chapter Award

During the 2022 IEEE Malaysia Section AGM held at Kuala Lumpur Convention Centre on 12th Feb 2022, IEEE EPS Malaysia Chapter, chaired by Dr Yik Yee Tan won the 2021 Outstanding Small Chapter Award.   The purpose of the award is to recognize the outstanding performance of the small chapter among all the small chapters in Malaysia Section. 

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Title: Advanced Packaging in Hyperscale Data Center Applications

Date:  May 6, 2022

Time:  12:00 pm EDT

Platform:  Webex

Presenter: Jie Xue, Vice President Technology & Quality, Cisco Systems, Inc.

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Abstract

Advanced Packaging technologies including Silicon and Silicon photonics are key enablers for scaling Hyperscale Data Center. This talk will discuss the roadmap of technology building blocks with a focus on increasing in performance while reducing power per Gbps. Challenges toward device integration, reliability and industry eco-system collaboration will also be elaborated.

BioJie Xue leads Cisco’s Technology and Quality organization, a global team responsible for pathfinding, developing, and executing technology innovations to enable all Cisco networking product portolio. Jie oversees development of leading edge technologies for Si-Photonics, Advanced Si, ASICs, PCBs, Optics, memory, and complex interconnect technologies.

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The EPS Technical Committee meetings to be held during ECTC 2022 are as scheduled.

Attendance is open to all.

 Technical Committee                  Date                    Time                                 Room

EPS Power & Energy TC            6/1/2022            7:00 am – 8:00 am           514

EDMS TC                                    6/1/2022            7:00 am – 8:00am            Driftwood 1

Reliability TC                               6/1/2022            7:00 am – 8:00am            Driftwood 2 

Emerging Tech TC                      6/2/2022            7:00 am – 8:00am            Driftwood 1

Photonics TC                              6/2/2022            7:00 am – 8:00am            Driftwood 2

Nanotechnology TC                    6/2/2022            7:00 am - 8:00 am           511

EPS RF & Thz Techn. TC/

ECTC Components Committee          6/3/2022             7:00 am – 8:00am           514 

3D TSV TC                                 6/3/2022             7:00 am – 8:00am           Driftwood 2

 

A Heterogeneous Integration Roadmap (HIR) Workshop will be held in conjunction with ECTC and ITherm this year.

Location:  The Sheraton San Diego Hotel and Marina

Date: May 31, 2022

Time: 8:00 am - 5:00 pm

In Person Only