IEEE COMCAS 2023
IEEE COMCAS 2023, The International Conference on Microwaves, Communications, Antennas, Biomedical Engineering & Electronic Systems, will be held from November 6-8, 2023, in Tel Aviv, Israel.
IEEE COMCAS is one of the world's leading IEEE conferences, where we welcome scientists, engineers, managers, and researchers (from academia, industry, and government institutions) from all over the world. In 2023, the International IEEE COMCAS conference will continue to evolve and provide an advanced multidisciplinary forum for the exchange of ideas, research results, and industry experience in a range of key areas, i.e., microwaves, communications and sensors, antennas, biomedical engineering, RF and microwave devices and circuits, thermal management and electronic packaging, signal processing, and imaging, as well as radar, acoustics, and microwave system engineering.
The 73rd ECTC Program is Now Online
The premier international packaging, components, and microelectronics systems technology conference.
ECTC is the only event that offers an outstanding array of packaging technology information and four full days of engaging seminars. The over 350 technical papers cover advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high speed and high bandwidth, photonics, quantum electronics, flexible and printed electronics.
The 2023 Program Includes:
- 41 Technical sessions with a total number of 350+ technical papers including:
- 5 Interactive Session including one student session
- 9 Special invited sessions plus a diversity panel and a Young Professionals event
- 16 CEU-approved Professional Development Courses
To learn more about the conference go to the ECTC website and join the ECTC LinkedIn group to receive the latest updates on the most important topics in microelectronic packaging.
Program details can be found here
3DIC 2023 Call For Papers
May 10 - 12, 2023
Tyndall National Institute
Cork, Ireland
This 2.5 day 3DIC Conference will include Invited Presentations, Solicited Presentations, Posters, and a Special Panel Session on “Future Directions for 3DIC”. Attendees can also participate in a tour of Tyndall’s state-of-the-art facilities for materials synthesis, fabrication, packaging and characterisation of microelectronics, MEMS and photonics materials, devices and circuits.
Abstract submission: February 23rd 2023
Sixth Annual Heterogeneous Integration Roadmap Symposium
Key Talks on the Future of Heterogeneous Integration:
-- 8 plenary talks from NIST, DoD, IBM, Samsung, Intel, AMD, ITRI, Penn State, working group reports ...
-- Thursday-Friday, February 23-24, 2023
-- In-person at SEMI World Hdqtrs, Milpitas, and via WebEx
-- Cost: $75 (includes lunches) or $40 (via WebEx)
-- "HI Platform for Next Generation Computing (‘Beyond Moore’)" Dr Moonsoo Kang, Executive Vice President, Advanced Packaging Business, Samsung Electronics
-- "HI Development – Interdisciplinary Innovations" Dr. Xin Wu, Corporate Vice President, Advanced Micro Devices
-- "AI for Chip Technology and Heterogeneous Integration" Dr. Wei Chen Lo, Deputy General Director, Electronic/Opto System Rsch Labs, ITRI
-- "High-Bandwidth Interconnect for an Open Chiplet Ecosystem" Dr. Debendra Das Sharma, Senior Fellow, Intel Corp.
-- "The CHIPS Act-related National Advanced Packaging Manufacturing Program" Dr Scott Sikorski, Technology Business Development Executive, IBM Corp.
-- "HI for the Next Decade – An Academic Perspective" Prof. Madhavan Swaminathan, Center for Heterogeneous Integration & EE Dept Head, Penn State University
... plus talks from NIST, Dept of Defense; key updates from HI Roadmap Working-Groups
Get your IEEE EPS Membership Certificate
The 2023 IEEE EPS membership certificates are now available.
Steps to download and print your certificate:
- Log into IEEE Collabratec at ieeecollabratec.org
- Click on your name in the top right of the screen and select “IEEE Membership Certificates”.
- From the “Member Certificates” page select your certificate to download the PDF.
- Open the PDF and print.