Most Popular T-CPMT Papers
Most accessed documents for the month of December, 2017
Manufacturing Considerations in the 3-D Printing of Fractal Antennas
Sung Yun Jun ; Benito Sanz-Izquierdo ; Edward A. Parker ; David Bird ; Alan McClelland
Publication Year: 2017, Page(s):1891 - 1898
3-D Printed Metal-Pipe Rectangular Waveguides
Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn
Publication Year: 2015, Page(s):1339 - 1349
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
John H. Lau ; Ming Li ; Dewen Tian ; Nelson Fan ; Eric Kuah ; Wu Kai ; Margie Li ; J. Hao ; Yiu Ming Cheung ; Zhang Li ; Kim Hwee Tan ; Rozalia Beica ; Thomas Taylor ; Cheng-Ta Ko ; Henry Yang ; Yu-Hua Chen ; Sze Pei Lim ; Ning Cheng Lee ; Jiang Ran ; Cao Xi; Koh Sau Wee ; Qingxiang Yong
Publication Year: 2017, Page(s):1729 - 1738
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Upcoming Webinar
A Moore's Law for Packaging
Date and Time: March 21, 2018 11:00 AM EST
Presenter: Subramanian Iyer
Host: Alan Huffman
Abstract:
While Silicon has scaled aggressively by over a factor of a few thousand over the last six decades the progress in packaging has been more modest – a linear factor 4-5 in most cases. In this talk, we will examine the reasons for this lag and what we are doing to fix this imbalance. Packaging is undergoing a renaissance where chip-to-chip interconnects can approach the densities of on-chip interconnects. We will discuss the technologies that are making this happen and how these can change our thinking on architecture and future manufacturing. Specifically, we will discuss two embodiments: Silicon as the next generation packaging substrate, and Flexible electronics using fan-out wafer level processing. Finally, we’ll discuss how these developments can help put some intelligence into Artificial Intelligence and bring about changes in Medical Engineering.
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