Sustainable and Green Electronics: Carbon Neutrality
Nils Nissen, Sustainability and Green Electronics Technical Committee Chair
In the past months, many large tech companies have announced new or revised goals for reaching CO2 neutrality. Increasingly, these activities filter up through the supply chain and now reach electronic packaging as well. The technical committee Sustainability and Green Electronics is aiming to gather experiences from within the electronics packaging community and to provide guidance to those, for whom this is a new topic.
Goal setting examples
Most prominently, Apple announced in July of 2020 to achieve climate neutrality in 2030 in-cluding the whole supply chain and the whole life cycle of Apple products. Other companies such as Google, Microsoft, Amazon or Bosch have existing or new commitments – some al-ready claiming carbon neutrality before 2020, some aiming at the end of 2020. So – is the Apple announcement ahead of the competition or behind?
Nanopackaging Technology Highlights at Recent ECTC and IEEE NANO 2020
P M Raj, Florida International University, Miami, Nanotechnology Technical Committee Chair
The primary mission of Nanopackaging TC is to promote nanotechnologies to packaging community and accelerate their adoption by disseminating the knowledge through conferences, webinars, industry-academia interactions, IEEE web portals, newsletters and other means. The final goal is to create synergistic research ecosystems to solve the technical barriers and enable future electronics. The recent conferences, IEEE NANO and ECTC brought several key advances in nanopackagingt to limelight. This newsletter highlights those advances and also provides details about upcoming IEEE NMDC 2021 and upcoming IEEE International Electronics Week in Europe.
Emerging technologies in electronic packaging
Benson Chan, Emerging Technologies Technical Committee Chair
The following are fifteen recent Binghamton University’s Integrated Electronics Engineering Center (IEEC) “Flashes” that pertain to emerging technologies in electronic packaging. These Flashes are published by the IEEC monthly and is meant to bring the latest news relating to electronics packaging. If you are interested in reading more about these news briefs, the titles have hyperlinks to the source articles.
Shrunken nanolasers enable on-chip optical connections
Researchers from the Moscow Institute of Physics and Technology cleared the obstacle that had prevented the creation of electrically driven nanolasers for ICs. The approach enables a coherent light source design on the scale smaller than the wavelength of light emitted by the laser. This enables ultrafast optical data transfer in microprocessors. The proposed new scheme for electrical pumping is based on a double heterostructure with a tunneling Schottky contact. It makes the ohmic contact with its strongly absorbing metal redundant. The pumping now happens across the interface between the plasmonic metal and semiconductor, along which SPPs propagate.
Electronics cooling using additive manufacturing
Researchers from the University of Illinois have developed a new type of air jet cooler that overcomes previous barriers to jet cooling systems. Using additive manufacturing, they created an air jet cooling system in a single component that can direct high-speed air onto multiple electronics hot spots. They manufactured the cooling system using polymer materials that can withstand the harsh conditions associated with high-speed air jets (200 mph). The research focused on heat removal from high-power electronic devices in a host of applications including electric vehicles, aircraft, and automotive.
EDAPS 2020 Call for Papers
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia‐Pacific region to share the recent progress of design, modeling, simulation and measurement related to the electrical issues arising at the chip, package and system levels. Covering the paper presentations, industry exhibitions, workshops and tutorials, the EDAPS 2020 will be held virtually from December 14 to 16, 2020. The technical program of the symposium not only addresses the current technical issues but also brings out the topics on IC design, SiP/SoP packaging, EMI/EMC, EDA tools and most importantly the challenge issues in advanced 3D‐IC and TSV design. For further information, please visit the website at to edaps.org.
Symposium on Reliability for Electronics and Photonics Packaging (IEEE- REPP) : Register Now
As the organizing team, we are excited to invite you to register for this new EPS symposium. It features eminent Keynote talks and presentations in the evolving and exciting field of Electronics and Photonics packaging. This 2-day virtual event will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic and photonic assemblies, packages and systems. This includes failure modes, mechanisms, design, simulation and accelerated testing.
to galvanize an increased conversation on reliability of electronics and photonics integration.
Gnyan Ramakrishna, Chair, EPS TC-Photonics, and Richard Rao, Chair, EPS TC-Reliability