Emerging Technology Technical Committee Webinar
Title: Green Electronics – Our Required Contribution to Global Environmental Goals
Date: May 18,, 2021
Time: 4:00 – 4:45 PM CET
Presenter: Nils Nissen
Abstract: More and more companies are setting climate neutrality goals, and countries and regions have been strengthening their commitments over the last weeks. While the electronics industry is not among the biggest contributors to climate relevant emissions, we have to drastically improve within the industry, while at the same time help other sectors to decarbonize. The goals set by companies trickle up the supply chain and now affect more suppliers of components, and indeed the development of new technologies.
EPTC 2021: Call for Papers
The 23rd IEEE Electronics Packaging Technology Conference (EPTC2021) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by IEEE Electronics Packaging Society (EPS). EPTC2021 conference will feature keynotes, technical sessions, technology talks, exhibition corners and networking activities. It aims to provide a platform to cover the technology developments in the complete spectrum of electronics packaging from design to manufacturing. Since its inauguration in 1997, EPTC has established a highly reputed electronics packaging conference in Asia and selected as an EPS flagship conference in the Asia-Pacific Region 10, covering diverse reas of electronic packaging technology topics. These include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, Internet of things (IOT), 5G, autonomous vehicles, photonics, emerging technologies, 2.5D/3D integration technology and, smart manufacturing.
New Materials and Processes for Flexible Electronics
Abstract— Over the last decades, we have seen an increased need for flexible hybrid electronics (FHE) especially in the mobile, wearable, and medical devices. Recently additional applications and technologies have emerged e.g. stretchable and conformable electronics. 3D and foldable smart devices enable novel applications with new levels of user convenience and human-machine interfaces.
The range of processes and materials applied in products and research has become very broad. Various types of flexible and stretchable base materials are available with different thermal, electrical and mechanical properties. They have to match the requirements of subsequent processes and those of the final application. Besides photolithographic processes novel flexible and stretchable electrical circuits are realized by different printing technologies using conductive polymers, percolation networks or liquid metals. Alternatively, higher densities can be achieved by photolithographic structuring of meander-shaped or buckling conductors or fine meshes. The modules can finally be dynamically flexible or stretchable or they can be brought in 3D shapes by 3D printing, thermoforming, or injection molding to generate smart 3D surfaces and structures.
HIR Workshop at ECTC and ITherm 2021
Heterogeneous Integration Roadmap (HIR), released October 2019, is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines.
The workshop content will be available on demand and is open to everyone. The purpose of the HIR workshop is to broaden the proliferation of the roadmap content to the virtual participants for dialogue and feedback for inclusion into the 2021 edition.
There will also be two live Panel Sessions: "Rising to the Chiplet Challenge" on June 2nd and "Test in Heterogeneous Integration" on June 4th. These panels are included with ECTC registration.
EMPC 2021
Dear Microelectronics Professional,
The next European Microelectronics and Packaging Conference (EMPC2021) will be organised and hosted by IMAPS Nordic. EMPC2021 will be held Online from 13th to 16th September 2021.
This will be an important step in rebuilding the electronics business at the exit from the pandemic and provides an excellent opportunity for you and the microelectronics engineering community to meet a focused European and international customer base.
Please check out http://empc2021.org/conference/sponsorship-exhibitor-invitation/ for more information. This is an excellent opportunity for suppliers and manufacturers to participate in this leading event in Europe.
Additional opportunities are available to increase your influence by sponsorship of EMPC-2021.
We look forward to your involvement and to greeting you Online!
Paul Collander
paul.collander@imapsnordic.org
Exhibition Chair