Sixth Annual Heterogeneous Integration Roadmap (HIR) Symposium 2023
All times are Pacific Standard Time
Pre-Symposium Tutorials: Wednesday, 22 February 2023 (1:00 – 4:30 PM)
-Tutorial on Chiplets (including UCIe and BoW)
-or: Tutorial on three NIST-sponsored Roadmaps
No cost to attend just the Wednesday Tutorials
-In-person only (at SEMI Hdqtrs, Milpitas)
Symposium Dates: Thursday & Friday, 23-24 February 2023 (schedule below)
Four Invited Plenary Presentations each morning – Critical Issues in Electronics Resurgence for next decade & beyond
Key messages from groupings of the HIR Chapters (with cross-TWG panels)
Cross TWG Collaborations & Dialogues
Planning for 2023 conference events, workshops & collaborations
More info and to register https://r6.ieee.org/scv-eps/?p=3003
Update on the CHIPS and Science Act
Abstract
The 2022 CHIPS and Science Act is the largest investment into the microelectronics industry made by the US government in history. The intent of this legislation is to strengthen the competitiveness of domestic manufacturers and suppliers for microelectronics assemblies. The sweeping vision from the signing brief stated that with this legislation, the US is “making historic investments that will poise U.S. workers, communities, and businesses to win the race for the 21st century. It will strengthen American manufacturing, supply chains, and national security. The Act provides money for investment in research and development, science and technology, and the workforce of the future to keep the United States the leader in the industries of tomorrow, including nanotechnology, clean energy, quantum computing, and artificial intelligence. The CHIPs and Science Act makes the smart investments so that American to compete in and win the future.”1
What is the CHIPS and Science Act?
The CHIPS and Science Act seeks to do the following:
• Increase capacity in domestic manufacturing and emerging technologies
• Promote critical supply chain resilience
• Strengthen the national capacity for manufacturing innovation, and expands workforce development efforts
• Deliver important measurement and technology to semiconductor R&D needs
EPS Awards Nomination Period Closes 21 January, 2023
The EPS Awards Program recognizes contributions to the profession, industry and the Society through a comprehensive set of awards and recognitions.
EPS Major Awards
A series of EPS Major Awards, recognizing technical contributions and service, is administered by the EPS Awards Committee:
· Outstanding Sustained Technical Contribution Award
· Electronics Manufacturing Technology Award
· David Feldman Outstanding Contribution Award
· Exceptional Technical Achievement Award
· Outstanding Young Engineer Award
· Regional Contributions Award
The Society also sponsors a PhD Fellowship to promote, recognize, and support PhD level study and research within the Electronics Packaging Society’s field of interest.
Society Digital Library
The Member Digital Library (MDL) is available to members who join EPS or renew membership for 2023.
EPS members now have online access to EPS' full archive of sponsored technical content, including conference proceedings and journals at no additional charge. This includes ECTC, HOLM, ESTC, EPTC, the IEEE Transactions on Components, Packaging and Manufacturing Technology and much more!
Unlimited access to current and past issues of T-CPMT and proceedings for EPS sponsored conferences from current year to the early nineties. MDL .